Evaluation of Cassava Chip Crispness Using a Fuzzy Logic System Based on Temperature and Vacuum Pressure Variables. Journal of Applied Science, Technology & Humanities | JASTH, [S. l.], v. 3, n. 1, p. 839–850, 2026. DOI: 10.62535/cz87d281. Disponível em: https://batrisyaedu.com/journal/index.php/batrisya/article/view/185.. Acesso em: 29 aug. 2026.